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Cu-ETP - KME

2021326 · Cu-ETP Alloy Designation EN Cu-ETP DIN CEN/TS 13388 CW004A UNS C11000 Chemical Composition (Balance) Weight percentage Cu ≥ 99.90 % O ≤ 0.040 %

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: 126KB

C11000|E-Cu|Cu-ETP|T2 ...

2023315 · . C11000. . Cu-ETP. . . 2012,-,,,

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Cu-ETP_

2017515 · Cu-ETP,,370:-250,。 Cu-ETP

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Conductor materials: Copper - Cu-ETP & Cu-OF

The hydrogen disease, also known as embrittlement, is a phenomenon caused by a chemical reaction. When heated up beyond 500 °C, the

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Composition: Cu ≥ 99.90**Oxygen max. 0.040

Cu-ETPCu-ETPCu-ETP

202329 · Cu-ETP..,。.,.,“”,

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CU-ETP-R240 EN13599_

2014124 · . cu-etpr240,240. Cu-ETP。. 。. ,1083℃,

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20161228 · ,. GB DIN EN ISO UNS JIS TU2 OF-Cu 2.0040 Cu

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【Cu-ETP-R200Cu-ETP-R220Cu-ETP ...

2  ·  Cu-ETP-R200Cu-ETP-R220Cu-ETP-R240 ,,、

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Cu ETP | Robert Laminage

2  · Cu ETP CUIVRE - CuA1 Cu>99.9 O0.04 max. Composition chimique; Cu 99.9. Pb 0.005 max. O 0.005-0.04. Dénomination de l’alliage; N° RLSA: 100: Norme EN:

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CU - Etp のな、にする

CU - Etp のな、にするなホイル 0.005mm の × 100mm から, をリードする なタンタル ホイル , なで チタニウム ホイル , をみす チ

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Wieland-K32

20211028 · Electrolytic tough-pitch copper (Cu-ETP) is the standard oxygen containing pure copper grade. It is very commonly used for electronics and electric engineering components in cases that high conductivity (100 % IACS) is requested and mechanical strength may be low. Typical applications of Cu-ETP strip are stamping

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Electrochemical leaching of critical materials from lithium

It should be noted that ECL recovers Cu as electroplated Cu metal deposited in the cathode, and graphite is produced as by-products of all three leaching methods and extracted separately from the leachate. ... GWP= global warming potential, SMG=smog, ACD=acidification, ETP=eutrophication, CAR=carcinogenics, NCAR=non-carcinogenics,

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Cu-ETP CW004A Cu-ETP C11000 C1100 TP2 SF-Cu 2.0090 Cu-DHP CW024A Cu-DHP C12200 C1220-SF-Cu 2.0090 Cu-DHP CW024A Cu-DHP C12200 C1220-SF-Cu 2.0090 Cu-DHP CW024A CW614N CuZn39Pb3 C38500 C3603-CuZn40Pb2 2.0402 CW617N

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Cu-ETP / CW004A - SteelNumber - Copper equivalent,

Wrought and unwrought forging stock. EN 12420: 1999 Copper and copper alloys. Forgings. EN 13148: 2001 Copper and copper alloys. Hot-dip tinned strip. Equivalent grades: Go here. Chemical composition % of grade Cu-ETP ( CW004A ) Cu including Ag < 0.015%; O < 0.06% is permitted.

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Copper and copper alloys

Our complete product range. To show the product portfolio of a specific location, please select the company: Copper. High-performance alloys. Copper-nickel alloy. Cast Alloy. High-copper alloy. Products. Foil.

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2021124 ·  GB DIN EN ISO UNS JIS TU2 OF-Cu Cu-OFE CW009A Cu-OF C10100 C1011 - SE-Cu Cu-HCP CW021A - C10300 - - SE-Cu Cu-PHC CW020A - C10300 - T2 E-Cu58 Cu-ETP CW004A Cu-ETP C11000 C1100 TP2 SF-Cu Cu-DHP CW024A Cu-DHP C12200 C1220

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Cu-ETP?_

2021115 · Cu-ETP: ,,,、。 、(、)、、(、),,。

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Cu-ETPCu-ETP -

2022228 · Cu-ETP. Cu-ETP,Cu-ETP,,. :Cu-ETP. : (GB/T5231-2001) :. ..,。. .,.,“”, ...

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Cu-ETP-R290 -

2022220 · Cu-ETP-R290. ,,。. : ()、、、、、。.

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:CU-ETP R250?R250? ...

20151112 · ?. CU-ETP,,。. R25025mm×3,。. 。. ,。. ,CU-ETP, ...

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Cu-ETP CW004A Cu-ETP C11000 C1100 TP2 SF-Cu 2.0090 Cu-DHP CW024A Cu-DHP C12200 C1220-SF-Cu 2.0090 Cu-DHP CW024A Cu-DHP C12200 C1220-SF-Cu 2.0090 Cu-DHP CW024A CW614N CuZn39Pb3 C38500 C3603-CuZn40Pb2 2.0402 CW617N

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T2,C11000,C1100,Cu-ETP,CW004A,2.0065

2021728 · T2,C11000,C1100,Cu-ETP,CW004A,2.0065. ,“”、“”“”。. ,,,。. T2,,

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CuETP -

Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) obtained from wire rod after annealing process . Elongation vs strain of Cu-ETP wires (diameter 0.5-8.0 mm) obtained from wire rod after annealing

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Cu-ETP?_

2021115 · Cu-ETP: ,,,、。 、(、)、、(、),,。

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2021124 ·  GB DIN EN ISO UNS JIS TU2 OF-Cu Cu-OFE CW009A Cu-OF C10100 C1011 - SE-Cu Cu-HCP CW021A - C10300 - - SE-Cu Cu-PHC CW020A - C10300 - T2 E-Cu58 Cu-ETP CW004A Cu-ETP C11000 C1100 TP2 SF-Cu Cu-DHP CW024A Cu-DHP C12200 C1220

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:CU-ETP H085 。 ...

2010919 · Cu-ETP..,。.,.,“”,(>370°)(.) 。

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.doc-

20181115 ·  GB DIN EN ISO UNS JIS TU2 OF-Cu 2.0040 Cu-OFE CW009A Cu-OF C10100 C1011 - SE-Cu 2.0070 Cu-HCP CW021A - C10300 - - SE-Cu 2.0070 Cu-PHC CW020A - C10300 - T2 E-Cu58 2.0065 Cu-ETP CW004A Cu-ETP C11000 C1100 TP2 SF-Cu 2.0090 Cu-DHP CW024A

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CU-ETP CUETP__

2021315 · CU-ETP CUETP. . 7. M006 CU-DLP MS58 MS59 MS60 MS62 MS65 MS67 MS68 MS69 MS70 MS72 MS75 MS78 MS80 MS82 MS85 MS88 MS89 MS90 MS92 MS95 MS98 ALBROMET w200 ALBROMET w130 ALBROMET w164 ALBROMET 380 ALBROMET w164

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2012619 ·  TP1 C1201 SW-Cu C12000 TP2 C1220 SF-Cu C12000 --

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Cu-ETP-R290 -

2022220 · Cu-ETP-R290. ,,。. : ()、、、、、。.

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Cu-ETP - Aurubis

2021728 · Cu-ETP is an electrolytically refined, oxygen-containing copper. It has a very good electrical conductivity and is economically interesting, compared to other high-conductivity copper alloys. Due to the residual oxygen content the alloy it is not suited for welding because it is susceptible to hydrogen embrittlement.

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Cu-ETP - KME

2021326 · Cu-ETP Legierungsbezeichnung EN Cu-ETP DIN CEN/TS 13388 CW004A UNS C11000 Chemische Zusammensetzung (Richtwerte) Gewichtsanteil in Prozent Cu ≥ 99.90 % O ≤ 0.040 % Eigenschaften Cu-ETP ist ein sauerstoffhaltiges Kupfer, das eine sehr hohe elektrische und thermische Leitfähigkeit besitzt. Es hat ausgezeichnete

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Electrochemical leaching of critical materials from lithium

It should be noted that ECL recovers Cu as electroplated Cu metal deposited in the cathode, and graphite is produced as by-products of all three leaching methods and extracted separately from the leachate. ... GWP= global warming potential, SMG=smog, ACD=acidification, ETP=eutrophication, CAR=carcinogenics, NCAR=non-carcinogenics,

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Conductor materials: Copper - Cu-ETP & Cu-OF

The hydrogen disease, also known as embrittlement, is a phenomenon caused by a chemical reaction. When heated up beyond 500 °C, the metal grid of the copper is impregnated by nuclear hydrogen (H 2) and reacts

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CU-ETP CU-ETP

2022710 · CU-ETP: CU-ETP 1/4H 3/4H 1/2H O CU-ETP : CU-ETP CU-ETP CU-ETP

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CU-ETP CUETP__

2021315 · CU-ETP CUETP. . 7. M006 CU-DLP MS58 MS59 MS60 MS62 MS65 MS67 MS68 MS69 MS70 MS72 MS75 MS78 MS80 MS82 MS85 MS88 MS89 MS90 MS92 MS95 MS98 ALBROMET w200 ALBROMET w130 ALBROMET w164 ALBROMET 380 ALBROMET w164

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Cu-ETP-R250【】_

2020125 · Cu-ETP-R250 7 : : : :,,,,,,,,, ...

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Cu-ETP-R250

2020721 · Cu-ETP-R250:(),,。 99-99.9%,99.95-99.***。

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Leitermaterialien: Kupfer - Cu-ETP & Cu-OF –

Die Zielmärkte für Drähte und Litzen aus Kupfer und galvanisch beschichtetem Kupfer können hier in zwei große Bereiche eingeteilt werden: Weiterverarbeitung in der Kabelindustrie, Extrusion. Weiterverarbeitung

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Cu-ETP-R300

2020721 · Cu-ETP-R300,Cu-ETP-R300,Cu-ETP-R300,Cu-ETP-R300,Cu-ETP-R300 : :,、,、,(: ...

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